Kjøpe B32933A3474K189 med BYCHPS
Kjøp med garanti
B32933A3474K189
- Delenummer:
- B32933A3474K189
- Produsent:
- EPCOS
- Beskrivelse:
- FILM CAP MKT (85/85/1000) X2 0.4
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18347 Pieces
- Dataark:
- B32933A3474K189.pdf
Introduksjon
BYCHIPS er strømprodusenten for B32933A3474K189, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for B32933A3474K189 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | B32933A3474K189 |
| Utvidet beskrivelse: | Film Capacitor |
| Beskrivelse: | FILM CAP MKT (85/85/1000) X2 0.4 |
| Email: | [email protected] |
Beslektede deler til B32933A3474K189
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
B32933A3474M289 | EPCOS (TDK) | CAP FILM 0.47UF 20% 305VAC RAD | Forespørsel |
|
B32933A3474K000 | EPCOS (TDK) | CAP FILM 0.47UF 10% 305VAC RAD | Forespørsel |
 |
B32933A3474M000 | EPCOS (TDK) | CAP FILM 0.47UF 20% 305VAC RAD | Forespørsel |
|
B32933A3155M | EPCOS (TDK) | CAP FILM 1.5UF 20% 305VAC RADIAL | Forespørsel |
 |
B32933A3684K | EPCOS (TDK) | CAP FILM 0.68UF 10% 305VAC RAD | Forespørsel |
|
B32933A3684K189 | EPCOS (TDK) | CAP FILM 0.68UF 10% 305VAC RAD | Forespørsel |
|
B32933A3154K289 | EPCOS (TDK) | CAP FILM 0.15UF 10% 305VAC RAD | Forespørsel |
|
B32933A3334K189 | EPCOS (TDK) | CAP FILM 0.33UF 10% 305VAC RAD | Forespørsel |
|
B32933A3474M189 | EPCOS (TDK) | CAP FILM 0.47UF 20% 305VAC RAD | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers