Kjøpe BAP55L,315 med BYCHPS
Kjøp med garanti
BAP55L,315
- Delenummer:
- BAP55L,315
- Produsent:
- NXP Semiconductors / Freescale
- Beskrivelse:
- DIODE PIN 50V 100MA SOD-882
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16124 Pieces
- Dataark:
- BAP55L,315.pdf
Introduksjon
BYCHIPS er strømprodusenten for BAP55L,315, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BAP55L,315 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Peak Reverse (Max): | 50V |
|---|---|
| Leverandør Enhetspakke: | DFN1006-2 |
| Serie: | - |
| Motstand @ Hvis, F: | 700 mOhm @ 100mA, 100MHz |
| Strømdissipasjon (maks): | 500mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | SOD-882 |
| Andre navn: | 568-1925-2 934058521315 BAP55L T/R |
| Driftstemperatur: | -65°C ~ 150°C (TJ) |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | BAP55L,315 |
| Utvidet beskrivelse: | RF Diode PIN - Single 50V 100mA 500mW DFN1006-2 |
| Diodetype: | PIN - Single |
| Beskrivelse: | DIODE PIN 50V 100MA SOD-882 |
| Nåværende - Maks: | 100mA |
| Kapasitans @ Vr, F: | 0.28pF @ 20V, 1MHz |
| Email: | [email protected] |
Beslektede deler til BAP55L,315
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BAP55LX,315 | NXP USA Inc. | DIODE SILICON PIN SOD-882D | Forespørsel |
 |
BAR 88-02V E6127 | Infineon Technologies | DIODE PIN SGL 80V 100MA SC-79 | Forespørsel |
 |
HSMS-2855-TR1G | Broadcom Limited | DIODE SCHOTTKY DETECT SS SOT-143 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers