Kjøpe BAT6806E6327HTSA1 med BYCHPS
Kjøp med garanti
BAT6806E6327HTSA1
- Delenummer:
- BAT6806E6327HTSA1
- Beskrivelse:
- DIODE SCHOTTKY 8V 130MA SOT-23
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12060 Pieces
- Dataark:
- BAT6806E6327HTSA1.pdf
Introduksjon
BYCHIPS er strømprodusenten for BAT6806E6327HTSA1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BAT6806E6327HTSA1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Peak Reverse (Max): | 8V |
|---|---|
| Leverandør Enhetspakke: | PG-SOT23-3 |
| Serie: | - |
| Motstand @ Hvis, F: | 10 Ohm @ 5mA, 10kHz |
| Strømdissipasjon (maks): | 150mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-236-3, SC-59, SOT-23-3 |
| Andre navn: | BAT 68-06 E6327 BAT 68-06 E6327-ND BAT6806E6327XT SP000010322 |
| Driftstemperatur: | 150°C (TJ) |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | BAT6806E6327HTSA1 |
| Utvidet beskrivelse: | RF Diode Schottky - 1 Pair Common Anode 8V 130mA 150mW PG-SOT23-3 |
| Diodetype: | Schottky - 1 Pair Common Anode |
| Beskrivelse: | DIODE SCHOTTKY 8V 130MA SOT-23 |
| Nåværende - Maks: | 130mA |
| Kapasitans @ Vr, F: | 1pF @ 0V, 1MHz |
| Email: | [email protected] |
Beslektede deler til BAT6806E6327HTSA1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BAT6804WH6327XTSA1 | Infineon Technologies | DIODE SCHOTTKY 8V 130MA SOT323 | Forespørsel |
|
BAT6806WE6327HTSA1 | Infineon Technologies | DIODE SCHOTTKY RF CA SOT-323 | Forespørsel |
|
BAT6806WH6327XTSA1 | Infineon Technologies | DIODE SCHOTTKY 8V 130MA SOT323 | Forespørsel |
|
BAT6804WE6327BTSA1 | Infineon Technologies | DIODE SCHOTTKY RF SERIES SOT-323 | Forespørsel |
 |
SMS3922-001LF | Skyworks Solutions Inc. | DIODE SCHOTTKY | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers