Kjøpe BB844E6327HTSA1 med BYCHPS
Kjøp med garanti
BB844E6327HTSA1
- Delenummer:
- BB844E6327HTSA1
- Beskrivelse:
- DIODE VAR CAP 18V 50MA SOT-23
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17788 Pieces
- Dataark:
- BB844E6327HTSA1.pdf
Introduksjon
BYCHIPS er strømprodusenten for BB844E6327HTSA1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BB844E6327HTSA1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Peak Reverse (Max): | 18V |
|---|---|
| Leverandør Enhetspakke: | PG-SOT23-3 |
| Serie: | - |
| Q @ Vr, F: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-236-3, SC-59, SOT-23-3 |
| Andre navn: | BB 844 E6327 BB 844 E6327-ND BB844E6327XT SP000013388 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | BB844E6327HTSA1 |
| Utvidet beskrivelse: | Varactor 1 Pair Common Cathode 18V Surface Mount PG-SOT23-3 |
| Diodetype: | 1 Pair Common Cathode |
| Beskrivelse: | DIODE VAR CAP 18V 50MA SOT-23 |
| Kapasitansforhold: | C2/C8 |
| Kapasitansforhold: | 3.8 |
| Kapasitans @ Vr, F: | 13pF @ 8V, 1MHz |
| Email: | [email protected] |
Beslektede deler til BB844E6327HTSA1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BB178,115 | NXP USA Inc. | DIODE VHF VAR CAP 32V SOD523 | Forespørsel |
 |
BBY 56-02W E6327 | Infineon Technologies | DIODE TUNING 10V 20MA SCD-80 | Forespørsel |
 |
SMV2019-040LF | Skyworks Solutions Inc. | DIODE VARACTOR | Forespørsel |
 |
BB172X | NXP USA Inc. | DIODE VHF VAR CAP 32V SOD323 | Forespørsel |
|
BB182,315 | NXP USA Inc. | DIODE VHF VAR CAP 32V SOD523 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers