Kjøpe BD3869AF-E2 med BYCHPS
Kjøp med garanti
BD3869AF-E2
- Delenummer:
- BD3869AF-E2
- Produsent:
- LAPIS Semiconductor
- Beskrivelse:
- IC SOUND PROCESSOR 3CH SOP18
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19714 Pieces
- Dataark:
- BD3869AF-E2.pdf
Introduksjon
BYCHIPS er strømprodusenten for BD3869AF-E2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BD3869AF-E2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 5.3 V ~ 9.5 V |
|---|---|
| Leverandør Enhetspakke: | 18-SOP |
| spesifikasjoner: | - |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 18-SOIC (0.213", 5.40mm Width) |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antall kanaler: | 2 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | BD3869AF-E2 |
| Interface: | I²C |
| Funksjon: | Audio Signal Processor |
| Utvidet beskrivelse: | Audio Audio Signal Processor 2 Channel 18-SOP |
| Beskrivelse: | IC SOUND PROCESSOR 3CH SOP18 |
| applikasjoner: | Consumer Audio |
| Email: | [email protected] |
Beslektede deler til BD3869AF-E2
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BD3861FS-E2 | Rohm Semiconductor | IC SOUND PROCESSOR 32-SSOP | Forespørsel |
 |
LC89057W-VF4A-E | ON Semiconductor | IC AUDIO I/F TRANCEIVER 48SQFP | Forespørsel |
|
BD3861FS | Rohm Semiconductor | IC AUDIO CONTROL LSI SSOP-A32 | Forespørsel |
 |
B300W35A102XYG | ON Semiconductor | IC PROCESSOR AUDIO 24BIT 35WLCSP | Forespørsel |
 |
ADAV4622BSTZ | Analog Devices Inc. | IC AUD PRO ATV/SIF DECODE 80LQFP | Forespørsel |
|
TAS3103IDBTR | Texas Instruments | IC DGTL AUDIO PROC 38-TSSOP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers