Kjøpe BF1125-3 med BYCHPS
Kjøp med garanti
BF1125-3
- Delenummer:
- BF1125-3
- Produsent:
- API Delevan
- Beskrivelse:
- FERRITE CORE 191 OHM HINGED
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14927 Pieces
- Dataark:
- BF1125-3.pdf
Introduksjon
BYCHIPS er strømprodusenten for BF1125-3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BF1125-3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Round |
|---|---|
| Serie: | BF |
| rangeringer: | - |
| Ytre dimensjon: | 0.461" W x 0.512" H (11.70mm x 13.00mm) |
| Andre navn: | BF1125-3 BULK 500 BF11253 DN4706 |
| Monteringstype: | Free Hanging |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale: | API-1 |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | BF1125-3 |
| Lengde: | 0.984" (25.00mm) |
| Innvendig dimensjon: | 0.138" Dia (3.50mm) |
| Impedans @ Frekvens: | 191 Ohm @ 100MHz |
| Utvidet beskrivelse: | Hinged (Snap On) Free Hanging Ferrite Core 191 Ohm @ 100MHz ID 0.138" Dia (3.50mm) OD 0.461" W x 0.512" H (11.70mm x 13.00mm) Length 0.984" (25.00mm) |
| Design: | Hinged (Snap On) |
| Beskrivelse: | FERRITE CORE 191 OHM HINGED |
| Email: | [email protected] |
Beslektede deler til BF1125-3
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BF1125-5 | API Delevan Inc. | FERRITE CORE 154 OHM HINGED 5MM | Forespørsel |
 |
28B1000-000 | Laird-Signal Integrity Products | FERRITE CORE 151 OHM SOLID | Forespørsel |
 |
ESD-SR-110 | KEMET | FERRITE CORE HINGED 5MM | Forespørsel |
 |
74270091 | Wurth Electronics Inc. | FERRITE CORE 170 OHM SOLID 9.5MM | Forespørsel |
 |
74271221S | Wurth Electronics Inc. | FERRITE CORE 270 OHM HINGED | Forespørsel |
 |
782013046250 | Wurth Electronics Inc. | FERRITE CORE 255 OHM SOLID 5MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers