Kjøpe BFC2373GM824MI med BYCHPS
Kjøp med garanti
BFC2373GM824MI
- Delenummer:
- BFC2373GM824MI
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- CAP FILM 0.82UF 5% 630VDC RADIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14182 Pieces
- Dataark:
- BFC2373GM824MI.pdf
Introduksjon
BYCHIPS er strømprodusenten for BFC2373GM824MI, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BFC2373GM824MI via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 630V |
|---|---|
| Spenningsverdier - AC: | 160V |
| Toleranse: | ±5% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 1.024" L x 0.335" W (26.00mm x 8.50mm) |
| Serie: | MKT373M |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Radial |
| Andre navn: | 2222373GM824MI |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | BFC2373GM824MI |
| Lead Spacing: | 0.886" (22.50mm) |
| Høyde - sittende (maks): | 0.728" (18.50mm) |
| Egenskaper: | Long Life |
| Utvidet beskrivelse: | 0.82µF ±5% Film Capacitor 160V 630V Polyester, Metallized Radial |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polyester, Metallized |
| Beskrivelse: | CAP FILM 0.82UF 5% 630VDC RADIAL |
| kapasitans: | 0.82µF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til BFC2373GM824MI
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers