Kjøpe BFC237511104 med BYCHPS
Kjøp med garanti
BFC237511104
- Delenummer:
- BFC237511104
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- CAP FILM 0.1UF 3.5% 630VDC RAD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14394 Pieces
- Dataark:
- BFC237511104.pdf
Introduksjon
BYCHIPS er strømprodusenten for BFC237511104, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BFC237511104 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 630V |
|---|---|
| Spenningsverdier - AC: | 300V |
| Toleranse: | ±3.5% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 1.024" L x 0.354" W (26.00mm x 9.00mm) |
| Serie: | KP/MKP 375 |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial |
| Andre navn: | 222237511104 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | BFC237511104 |
| Lead Spacing: | 0.394" (10.00mm) |
| Høyde - sittende (maks): | 0.866" (22.00mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 0.1µF ±3.5% Film Capacitor 300V 630V Polypropylene (PP), Metallized Radial |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 0.1UF 3.5% 630VDC RAD |
| kapasitans: | 0.1µF |
| applikasjoner: | High Pulse, DV/DT |
| Email: | [email protected] |
Beslektede deler til BFC237511104
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog