Kjøpe BFC238350623 med BYCHPS
Kjøp med garanti
BFC238350623
- Delenummer:
- BFC238350623
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- CAP FILM 0.062UF 5% 1.6KVDC RAD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12212 Pieces
- Dataark:
- BFC238350623.pdf
Introduksjon
BYCHIPS er strømprodusenten for BFC238350623, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BFC238350623 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 1600V (1.6kV) |
|---|---|
| Spenningsverdier - AC: | 550V |
| Toleranse: | ±5% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 1.220" L x 0.512" W (31.00mm x 13.00mm) |
| Serie: | 383 |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial |
| Andre navn: | 2222 383 50623 222238350623 BC2002 BFC2 383 50623 BFC2 383 50623 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | BFC238350623 |
| Lead Spacing: | 1.083" (27.50mm) |
| Høyde - sittende (maks): | 0.906" (23.00mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 0.062µF ±5% Film Capacitor 550V 1600V (1.6kV) Polypropylene (PP), Metallized Radial |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 0.062UF 5% 1.6KVDC RAD |
| kapasitans: | 0.062µF |
| applikasjoner: | High Pulse, DV/DT |
| Email: | [email protected] |
Beslektede deler til BFC238350623
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers