Kjøpe BFC23837BFC2 med BYCHPS
Kjøp med garanti
BFC23837BFC2
- Delenummer:
- BFC23837BFC2
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- CAP FILM 2200PF 5% 2.5KVDC RAD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18276 Pieces
- Dataark:
- BFC23837BFC2.pdf
Introduksjon
BYCHIPS er strømprodusenten for BFC23837BFC2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BFC23837BFC2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 2500V (2.5kV) |
|---|---|
| Spenningsverdier - AC: | 900V |
| Toleranse: | ±5% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 1.024" L x 0.236" W (26.00mm x 6.00mm) |
| Serie: | 383 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Radial |
| Andre navn: | 2222 383 72222 222238372222 BFC2 383 7BFC2 BFC2 383 7BFC2 BFC238372222 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | BFC23837BFC2 |
| Lead Spacing: | 0.886" (22.50mm) |
| Høyde - sittende (maks): | 0.610" (15.50mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 2200pF ±5% Film Capacitor 900V 2500V (2.5kV) Polypropylene (PP), Metallized Radial |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 2200PF 5% 2.5KVDC RAD |
| kapasitans: | 2200pF |
| applikasjoner: | High Pulse, DV/DT |
| Email: | [email protected] |
Beslektede deler til BFC23837BFC2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers