Kjøpe BLS6G3135S-20,112 med BYCHPS
Kjøp med garanti
BLS6G3135S-20,112
- Delenummer:
- BLS6G3135S-20,112
- Produsent:
- Ampleon
- Beskrivelse:
- RF FET LDMOS 60V 15.5DB SOT608B
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16473 Pieces
Introduksjon
BYCHIPS er strømprodusenten for BLS6G3135S-20,112, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BLS6G3135S-20,112 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Test: | 32V |
|---|---|
| Spenningsvurdering: | 60V |
| Transistor Type: | LDMOS |
| Leverandør Enhetspakke: | CDFM2 |
| Serie: | - |
| Power - Output: | 20W |
| emballasje: | Bulk |
| Pakke / tilfelle: | SOT-608B |
| Andre navn: | 934061039112 BLS6G3135S-20,112-ND |
| Støy Figur: | - |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 13 Weeks |
| Produsentens varenummer: | BLS6G3135S-20,112 |
| Gevinst: | 15.5dB |
| Frekvens: | 3.1GHz ~ 3.5GHz |
| Utvidet beskrivelse: | RF Mosfet LDMOS 32V 50mA 3.1GHz ~ 3.5GHz 15.5dB 20W CDFM2 |
| Beskrivelse: | RF FET LDMOS 60V 15.5DB SOT608B |
| Nåværende vurdering: | 2.1A |
| Nåværende - Test: | 50mA |
| Email: | [email protected] |
Beslektede deler til BLS6G3135S-20,112
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BLS6G2731S-120,112 | Ampleon USA Inc. | RF FET LDMOS 60V 13.5DB SOT502B | Forespørsel |
 |
BLS6G3135-20,112 | Ampleon USA Inc. | RF FET LDMOS 60V 15.5DB SOT608A | Forespørsel |
|
BLS6G3135S-120,112 | Ampleon USA Inc. | RF FET LDMOS 60V 11DB SOT502B | Forespørsel |
 |
BLS6G2735L-30,112 | Ampleon USA Inc. | RF FET LDMOS 60V 13DB SOT1135A | Forespørsel |
 |
BLS6G2731S-130,112 | Ampleon USA Inc. | RF FET LDMOS 60V 12DB SOT9221 | Forespørsel |
 |
BLS6G3135-120,112 | Ampleon USA Inc. | RF FET LDMOS 60V 11DB SOT502A | Forespørsel |
 |
BLS6G2731P-200,117 | Ampleon USA Inc. | RF FET LDMOS 32V SOM038 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog