Kjøpe BPG255NPE med BYCHPS
Kjøp med garanti
BPG255NPE
- Delenummer:
- BPG255NPE
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- REPLACEMENT MODULE GDT 255V MCOV
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12579 Pieces
- Dataark:
- BPG255NPE.pdf
Introduksjon
BYCHIPS er strømprodusenten for BPG255NPE, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BPG255NPE via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - DC Spark Over (Nom): | 255V |
|---|---|
| Toleranse: | - |
| Serie: | BP |
| emballasje: | Bulk |
| Pakke / tilfelle: | Module, Plug-In |
| Antall polakker: | - |
| Monteringstype: | Holder |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | BPG255NPE |
| Impulsutladningstrøm (8 / 20μs): | 20000A (20kA) |
| Feil kort: | No |
| Utvidet beskrivelse: | Gas Discharge Tube 20000A (20kA) Holder |
| Beskrivelse: | REPLACEMENT MODULE GDT 255V MCOV |
| Email: | [email protected] |
Beslektede deler til BPG255NPE
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
B88069X9930B502 | EPCOS (TDK) | GDT 150V 20% 10KA T/H FAIL SHORT | Forespørsel |
 |
SL1024A230C | Littelfuse Inc. | GDT 230V 10KA | Forespørsel |
 |
BPG255NPEWE | Eaton | REPLACEMENT MODULE GDT 255V MCOV | Forespørsel |
|
B88069X4951T103 | EPCOS (TDK) | GDT 350V 15% 2.5KA | Forespørsel |
 |
2037-40-BLF | Bourns Inc. | GDT 400V 15% 5KA THROUGH HOLE | Forespørsel |
 |
2026-07-C2FLF | Bourns Inc. | GDT 75V 20% 20KA T/H FAIL SHORT | Forespørsel |
 |
2027-25-CLF | Bourns Inc. | GDT 250V 15% 10KA THROUGH HOLE | Forespørsel |
 |
2052-35-SM-RPLF | Bourns Inc. | GDT 350V 20% 5KA SURFACE MOUNT | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers