Kjøpe BSZ086P03NS3E G med BYCHPS
Kjøp med garanti
BSZ086P03NS3E G
- Delenummer:
- BSZ086P03NS3E G
- Beskrivelse:
- MOSFET P-CH 30V 40A TSDSON-8
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19643 Pieces
- Dataark:
- BSZ086P03NS3E G.pdf
Introduksjon
BYCHIPS er strømprodusenten for BSZ086P03NS3E G, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BSZ086P03NS3E G via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | 3.1V @ 105µA |
|---|---|
| Vgs (maks): | ±25V |
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Enhetspakke: | PG-TSDSON-8 |
| Serie: | OptiMOS™ |
| Rds På (Maks) @ Id, Vgs: | 8.6 mOhm @ 20A, 10V |
| Strømdissipasjon (maks): | 2.1W (Ta), 69W (Tc) |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 8-PowerTDFN |
| Andre navn: | BSZ086P03NS3E G-ND BSZ086P03NS3EG BSZ086P03NS3EGATMA1 SP000473016 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | BSZ086P03NS3E G |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 4785pF @ 15V |
| Gateavgift (Qg) (Maks) @ Vgs: | 57.5nC @ 10V |
| FET Type: | P-Channel |
| FET-funksjonen: | - |
| Utvidet beskrivelse: | P-Channel 30V 13.5A (Ta), 40A (Tc) 2.1W (Ta), 69W (Tc) Surface Mount PG-TSDSON-8 |
| Drivspenning (Maks. Rds På, Min Rds På): | 6V, 10V |
| Drain til Source Voltage (VDSS): | 30V |
| Beskrivelse: | MOSFET P-CH 30V 40A TSDSON-8 |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 13.5A (Ta), 40A (Tc) |
| Email: | [email protected] |
Beslektede deler til BSZ086P03NS3E G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog