Kjøpe BTS244ZE3062AATMA2 med BYCHPS
Kjøp med garanti
BTS244ZE3062AATMA2
- Delenummer:
- BTS244ZE3062AATMA2
- Beskrivelse:
- MOSFET N-CH 55V 35A TO220-5
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14113 Pieces
- Dataark:
- BTS244ZE3062AATMA2.pdf
Introduksjon
BYCHIPS er strømprodusenten for BTS244ZE3062AATMA2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BTS244ZE3062AATMA2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | 2V @ 130µA |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Enhetspakke: | PG-TO263-5 |
| Serie: | TEMPFET® |
| Rds På (Maks) @ Id, Vgs: | 13 mOhm @ 19A, 10V |
| Strømdissipasjon (maks): | 170W (Tc) |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-263-5, D²Pak (4 Leads + Tab), TO-263BB |
| Andre navn: | SP000910844 |
| Driftstemperatur: | -40°C ~ 175°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | BTS244ZE3062AATMA2 |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 2660pF @ 25V |
| Gateavgift (Qg) (Maks) @ Vgs: | 130nC @ 10V |
| FET Type: | N-Channel |
| FET-funksjonen: | Temperature Sensing Diode |
| Utvidet beskrivelse: | N-Channel 55V 35A (Tc) 170W (Tc) Surface Mount PG-TO263-5 |
| Drain til Source Voltage (VDSS): | 55V |
| Beskrivelse: | MOSFET N-CH 55V 35A TO220-5 |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 35A (Tc) |
| Email: | [email protected] |
Beslektede deler til BTS244ZE3062AATMA2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers