Kjøpe BUK7606-75B,118 med BYCHPS
Kjøp med garanti
BUK7606-75B,118
- Delenummer:
- BUK7606-75B,118
- Produsent:
- Nexperia
- Beskrivelse:
- MOSFET N-CH 75V 75A D2PAK
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17478 Pieces
- Dataark:
- BUK7606-75B,118.pdf
Introduksjon
BYCHIPS er strømprodusenten for BUK7606-75B,118, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BUK7606-75B,118 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | 4V @ 1mA |
|---|---|
| Vgs (maks): | ±20V |
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Enhetspakke: | D2PAK |
| Serie: | Automotive, AEC-Q101, TrenchMOS™ |
| Rds På (Maks) @ Id, Vgs: | 5.6 mOhm @ 25A, 10V |
| Strømdissipasjon (maks): | 300W (Tc) |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Andre navn: | 1727-5248-2 568-6572-2 568-6572-2-ND 934057112118 BUK7606-75B /T3 BUK7606-75B /T3-ND BUK7606-75B,118-ND BUK760675B118 |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | BUK7606-75B,118 |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 7446pF @ 25V |
| Gateavgift (Qg) (Maks) @ Vgs: | 91nC @ 10V |
| FET Type: | N-Channel |
| FET-funksjonen: | - |
| Utvidet beskrivelse: | N-Channel 75V 75A (Tc) 300W (Tc) Surface Mount D2PAK |
| Drivspenning (Maks. Rds På, Min Rds På): | 10V |
| Drain til Source Voltage (VDSS): | 75V |
| Beskrivelse: | MOSFET N-CH 75V 75A D2PAK |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 75A (Tc) |
| Email: | [email protected] |
Beslektede deler til BUK7606-75B,118
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers