Kjøpe BYV29X-500,127 med BYCHPS
Kjøp med garanti
BYV29X-500,127
- Delenummer:
- BYV29X-500,127
- Produsent:
- WeEn Semiconductors Co., Ltd
- Beskrivelse:
- DIODE GEN PURP 500V 9A TO220F
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12996 Pieces
- Dataark:
- BYV29X-500,127.pdf
Introduksjon
BYCHIPS er strømprodusenten for BYV29X-500,127, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BYV29X-500,127 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 1.25V @ 8A |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 500V |
| Leverandør Enhetspakke: | TO-220F |
| Hastighet: | Fast Recovery = 200mA (Io) |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 60ns |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-220-2 Full Pack, Isolated Tab |
| Andre navn: | 1740-1434 568-9721 568-9721-5 568-9721-5-ND 568-9721-ND 934055559127 BYV29X-500 BYV29X-500,127-ND BYV29X-500-ND |
| Driftstemperatur - Kobling: | 150°C (Max) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | BYV29X-500,127 |
| Utvidet beskrivelse: | Diode Standard 500V 9A Through Hole TO-220F |
| Diodetype: | Standard |
| Beskrivelse: | DIODE GEN PURP 500V 9A TO220F |
| Strøm - Omvendt lekkasje @ Vr: | 50µA @ 500V |
| Gjeldende - Gjennomsnittlig Rectified (Io): | 9A |
| Kapasitans @ Vr, F: | - |
| Email: | [email protected] |
Beslektede deler til BYV29X-500,127
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers