Kjøpe C4BTJBX4500ZAJJ med BYCHPS
Kjøp med garanti
C4BTJBX4500ZAJJ
- Delenummer:
- C4BTJBX4500ZAJJ
- Produsent:
- KEMET
- Beskrivelse:
- CAP FILM 5UF 5% 700VDC QC TERM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18405 Pieces
- Dataark:
- C4BTJBX4500ZAJJ.pdf
Introduksjon
BYCHIPS er strømprodusenten for C4BTJBX4500ZAJJ, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for C4BTJBX4500ZAJJ via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 700V |
|---|---|
| Spenningsverdier - AC: | 400V |
| Toleranse: | ±5% |
| Avslutning: | Quick Connect, Disconnect |
| Størrelse / Dimensjon: | 1.654" L x 1.102" W (42.00mm x 28.00mm) |
| Serie: | C4B |
| emballasje: | Bulk |
| Pakke / tilfelle: | Rectangular Box |
| Andre navn: | 399-6238 4BTJBX4500ZAJJ |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 19 Weeks |
| Produsentens varenummer: | C4BTJBX4500ZAJJ |
| Lead Spacing: | 1.004" (25.50mm) |
| Høyde - sittende (maks): | 1.457" (37.00mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 5µF ±5% Film Capacitor 400V 700V Polypropylene (PP), Metallized Rectangular Box |
| ESR (ekvivalent serieresistens): | 2.6 mOhm |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 5UF 5% 700VDC QC TERM |
| kapasitans: | 5µF |
| applikasjoner: | DC Link, DC Filtering; High Frequency, Switching; Snubber |
| Email: | [email protected] |
Beslektede deler til C4BTJBX4500ZAJJ
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers