Kjøpe C7563X7S1H226M230LE med BYCHPS
Kjøp med garanti
C7563X7S1H226M230LE
- Delenummer:
- C7563X7S1H226M230LE
- Produsent:
- TDK Corporation
- Beskrivelse:
- CAP CER 22UF 50V X7S 3025
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18213 Pieces
Introduksjon
BYCHIPS er strømprodusenten for C7563X7S1H226M230LE, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for C7563X7S1H226M230LE via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 50V |
|---|---|
| Toleranse: | ±20% |
| Tykkelse (Maks): | 0.098" (2.50mm) |
| Temperaturkoeffisient: | X7S |
| Størrelse / Dimensjon: | 0.295" L x 0.248" W (7.50mm x 6.30mm) |
| Serie: | C |
| rangeringer: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 3025 (7563 Metric) |
| Andre navn: | 445-174338-2 C7563X7S1H226M230LE-ND C7563X7S1H226MT009S |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount, MLCC |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | C7563X7S1H226M230LE |
| Lead Style: | - |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Egenskaper: | Soft Termination |
| Strykprosent: | - |
| Utvidet beskrivelse: | 22µF ±20% 50V Ceramic Capacitor X7S 3025 (7563 Metric) |
| Beskrivelse: | CAP CER 22UF 50V X7S 3025 |
| kapasitans: | 22µF |
| applikasjoner: | Boardflex Sensitive |
| Email: | [email protected] |
Beslektede deler til C7563X7S1H226M230LE
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog