Kjøpe CBTD16213DL,512 med BYCHPS
Kjøp med garanti
CBTD16213DL,512
- Delenummer:
- CBTD16213DL,512
- Produsent:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC FET BUS EXCH SWCH 56-SSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17378 Pieces
- Dataark:
- CBTD16213DL,512.pdf
Introduksjon
BYCHIPS er strømprodusenten for CBTD16213DL,512, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CBTD16213DL,512 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsforsyningskilde: | Single Supply |
|---|---|
| Spenning - Forsyning: | 4.5 V ~ 5.5 V |
| Type: | Bus FET Exchange Switch |
| Leverandør Enhetspakke: | 56-SSOP |
| Serie: | 74CBTD |
| emballasje: | Tube |
| Pakke / tilfelle: | 56-BSSOP (0.295", 7.50mm Width) |
| Andre navn: | 935270444512 CBTD16213DL CBTD16213DL-ND |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | CBTD16213DL,512 |
| Uavhengige kretser: | 1 |
| Utvidet beskrivelse: | Bus FET Exchange Switch 12 x 2:2 56-SSOP |
| Beskrivelse: | IC FET BUS EXCH SWCH 56-SSOP |
| Nåværende - Utgang Høy, Lav: | - |
| Krets: | 12 x 2:2 |
| Email: | [email protected] |
Beslektede deler til CBTD16213DL,512
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CBTD16212DGG,118 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-TSSOP | Forespørsel |
|
CBTD16213DGG,112 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-TSSOP | Forespørsel |
 |
CBTD16213DL,518 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-SSOP | Forespørsel |
|
CBTD16212DL,118 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-SSOP | Forespørsel |
|
CBTD16212DGG,112 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-TSSOP | Forespørsel |
|
CBTD16212DL,112 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-SSOP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers