Kjøpe CDEP1810NP-6R4MC-180 med BYCHPS
Kjøp med garanti
CDEP1810NP-6R4MC-180
- Delenummer:
- CDEP1810NP-6R4MC-180
- Produsent:
- Sumida Corporation
- Beskrivelse:
- FIXED IND 6.4UH 18A 3.29 MOHM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12116 Pieces
- Dataark:
- CDEP1810NP-6R4MC-180.pdf
Introduksjon
BYCHIPS er strømprodusenten for CDEP1810NP-6R4MC-180, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CDEP1810NP-6R4MC-180 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±20% |
| Leverandør Enhetspakke: | - |
| Størrelse / Dimensjon: | 0.866" L x 0.740" W (22.00mm x 18.80mm) |
| skjerming: | Shielded |
| Serie: | CDEP1810 |
| rangeringer: | - |
| Q @ Freq: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Nonstandard |
| Driftstemperatur: | -40°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ferrite |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | CDEP1810NP-6R4MC-180 |
| induktans: | 6.4µH |
| Høyde - sittende (maks): | 0.433" (11.00mm) |
| Frekvens - Test: | 100kHz |
| Frekvens - Selvresonans: | - |
| Utvidet beskrivelse: | 6.4µH Shielded Wirewound Inductor 18A 3.29 mOhm Max Nonstandard |
| Beskrivelse: | FIXED IND 6.4UH 18A 3.29 MOHM |
| DC-motstand (DCR): | 3.29 mOhm Max |
| Nåværende vurdering: | 18A |
| Nåværende - Metning: | 19.2A |
| Email: | [email protected] |
Beslektede deler til CDEP1810NP-6R4MC-180
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers