Kjøpe CDH3D13SHPNP-6R8MC med BYCHPS
Kjøp med garanti
CDH3D13SHPNP-6R8MC
- Delenummer:
- CDH3D13SHPNP-6R8MC
- Produsent:
- Sumida Corporation
- Beskrivelse:
- FIXED IND 6.8UH 1A 323.8 MOHM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12946 Pieces
- Dataark:
- CDH3D13SHPNP-6R8MC.pdf
Introduksjon
BYCHIPS er strømprodusenten for CDH3D13SHPNP-6R8MC, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CDH3D13SHPNP-6R8MC via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±20% |
| Leverandør Enhetspakke: | - |
| Størrelse / Dimensjon: | 0.157" L x 0.150" W (4.00mm x 3.80mm) |
| skjerming: | Unshielded |
| Serie: | CDH3D13D/SHP |
| rangeringer: | - |
| Q @ Freq: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Nonstandard |
| Driftstemperatur: | -40°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ferrite |
| Produsentens Standard Lead Time: | 13 Weeks |
| Produsentens varenummer: | CDH3D13SHPNP-6R8MC |
| induktans: | 6.8µH |
| Høyde - sittende (maks): | 0.055" (1.40mm) |
| Frekvens - Test: | 100kHz |
| Frekvens - Selvresonans: | - |
| Utvidet beskrivelse: | 6.8µH Unshielded Wirewound Inductor 1A 323.8 mOhm Max Nonstandard |
| Beskrivelse: | FIXED IND 6.8UH 1A 323.8 MOHM |
| DC-motstand (DCR): | 323.8 mOhm Max |
| Nåværende vurdering: | 1A |
| Nåværende - Metning: | 1A |
| Email: | [email protected] |
Beslektede deler til CDH3D13SHPNP-6R8MC
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers