Kjøpe CDK1307CILP40 med BYCHPS
Kjøp med garanti
CDK1307CILP40
- Delenummer:
- CDK1307CILP40
- Produsent:
- Exar Corporation
- Beskrivelse:
- IC ADC 12/13BIT 65MSPS 40QFN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15859 Pieces
- Dataark:
- CDK1307CILP40.pdf
Introduksjon
BYCHIPS er strømprodusenten for CDK1307CILP40, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CDK1307CILP40 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Leverandør Enhetspakke: | 40-QFN (6x6) |
|---|---|
| Serie: | * |
| emballasje: | Tray |
| Pakke / tilfelle: | 40-VFQFN Exposed Pad |
| Vannfølsomhetsnivå (MSL): | 2A (4 Weeks) |
| Produsentens varenummer: | CDK1307CILP40 |
| Utvidet beskrivelse: | Bit Analog to Digital Converter Input 40-QFN (6x6) |
| Beskrivelse: | IC ADC 12/13BIT 65MSPS 40QFN |
| Email: | [email protected] |
Beslektede deler til CDK1307CILP40
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CDK1307AILP40 | Exar Corporation | IC ADC 12/13BIT 20MSPS 40QFN | Forespørsel |
|
CDK1308DILP40 | Exar Corporation | IC ADC 10BIT 80MSPS 40QFN | Forespørsel |
|
CDK1307DILP40 | Exar Corporation | IC ADC 12/13BIT 80MSPS 40QFN | Forespørsel |
 |
ADS8326IDRBT | Texas Instruments | IC ADC 16BIT SAMPLING 8SON | Forespørsel |
|
CDK1307BILP40 | Exar Corporation | IC ADC 12/13BIT 40MSPS 40QFN | Forespørsel |
|
CDK1308BILP40 | Exar Corporation | IC ADC 10BIT 40MSPS 40QFN | Forespørsel |
|
CDK1308CILP40 | Exar Corporation | IC ADC 10BIT 65MSPS 40QFN | Forespørsel |
 |
LTC2348ILX-16#PBF | Linear Technology | IC ADC 16BIT 200KSPS 48LQFP | Forespørsel |
|
CDK1308AILP40 | Exar Corporation | IC ADC 10BIT 20MSPS 40QFN | Forespørsel |
 |
LTC2157IUP-12#PBF | Linear Technology | IC ADC DUAL 12BIT 250M 64-QFN | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers