Kjøpe CG6145SM med BYCHPS
Kjøp med garanti
CG6145SM
- Delenummer:
- CG6145SM
- Produsent:
- Littelfuse
- Beskrivelse:
- GDT 145V 3KA SURFACE MOUNT
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13272 Pieces
- Dataark:
- CG6145SM.pdf
Introduksjon
BYCHIPS er strømprodusenten for CG6145SM, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CG6145SM via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - DC Spark Over (Nom): | 145V |
|---|---|
| Toleranse: | - |
| Serie: | CG6 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 2-SMD Cylinder Square End |
| Andre navn: | F7387TR |
| Antall polakker: | 2 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | CG6145SM |
| Impulsutladningstrøm (8 / 20μs): | 3000A (3kA) |
| Feil kort: | No |
| Utvidet beskrivelse: | Gas Discharge Tube 3000A (3kA) 2 Pole Surface Mount |
| Beskrivelse: | GDT 145V 3KA SURFACE MOUNT |
| Email: | [email protected] |
Beslektede deler til CG6145SM
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
9400400000 | Weidmuller | GDT 90V 20KA DIN RAIL | Forespørsel |
 |
2027-42-BT1LF | Bourns Inc. | GDT 420V 15% 10KA THROUGH HOLE | Forespørsel |
 |
B88069X4390C251 | EPCOS (TDK) | GDT 400V 20KA | Forespørsel |
 |
GTCS25-551M-R02-2 | Littelfuse Inc. | GDT 550V 20% 2.5KA SURFACE MOUNT | Forespørsel |
 |
2036-23-C2 | Bourns Inc. | GDT 230V 20% 10KA THROUGH HOLE | Forespørsel |
|
B88069X3881T502 | EPCOS (TDK) | GDT 75V 20KA 2 POLE | Forespørsel |
 |
SL1411A075C | Littelfuse Inc. | GDT 75V 10KA | Forespørsel |
|
9400120000 | Weidmuller | GDT 230V 20% 2.5KA DIN RAIL | Forespørsel |
 |
GTCR38-900M-R10-FS | Littelfuse Inc. | GDT 90V 20% 10KA T/H FAIL SHORT | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog