Kjøpe CGA3E3X5R0J335M080AB med BYCHPS
Kjøp med garanti
CGA3E3X5R0J335M080AB
- Delenummer:
- CGA3E3X5R0J335M080AB
- Produsent:
- TDK Corporation
- Beskrivelse:
- CAP CER 3.3UF 6.3V X5R 0603
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14916 Pieces
Introduksjon
BYCHIPS er strømprodusenten for CGA3E3X5R0J335M080AB, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CGA3E3X5R0J335M080AB via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 6.3V |
|---|---|
| Toleranse: | ±20% |
| Tykkelse (Maks): | 0.035" (0.90mm) |
| Temperaturkoeffisient: | X5R |
| Størrelse / Dimensjon: | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
| Serie: | CGA |
| rangeringer: | AEC-Q200 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 0603 (1608 Metric) |
| Andre navn: | 445-12524-2 CGA3E3X5R0J335MT0Y0N |
| Driftstemperatur: | -55°C ~ 85°C |
| Monteringstype: | Surface Mount, MLCC |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | CGA3E3X5R0J335M080AB |
| Lead Style: | - |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Egenskaper: | - |
| Strykprosent: | - |
| Utvidet beskrivelse: | 3.3µF ±20% 6.3V Ceramic Capacitor X5R 0603 (1608 Metric) |
| Beskrivelse: | CAP CER 3.3UF 6.3V X5R 0603 |
| kapasitans: | 3.3µF |
| applikasjoner: | Automotive |
| Email: | [email protected] |
Beslektede deler til CGA3E3X5R0J335M080AB
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog