Kjøpe CGA5L1X8R1E335K160AC med BYCHPS
Kjøp med garanti
CGA5L1X8R1E335K160AC
- Delenummer:
- CGA5L1X8R1E335K160AC
- Produsent:
- TDK Corporation
- Beskrivelse:
- CAP CER 3.3UF 25V X8R 1206
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12723 Pieces
Introduksjon
BYCHIPS er strømprodusenten for CGA5L1X8R1E335K160AC, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CGA5L1X8R1E335K160AC via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 25V |
|---|---|
| Toleranse: | ±10% |
| Tykkelse (Maks): | 0.063" (1.60mm) |
| Temperaturkoeffisient: | X8R |
| Størrelse / Dimensjon: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Serie: | CGA |
| rangeringer: | AEC-Q200 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 1206 (3216 Metric) |
| Andre navn: | 445-174827-2 CGA5L1X8R1E335KT0Y0N |
| Driftstemperatur: | -55°C ~ 150°C |
| Monteringstype: | Surface Mount, MLCC |
| Produsentens varenummer: | CGA5L1X8R1E335K160AC |
| Lead Style: | - |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Egenskaper: | High Temperature |
| Strykprosent: | - |
| Utvidet beskrivelse: | 3.3µF ±10% 25V Ceramic Capacitor X8R 1206 (3216 Metric) |
| Beskrivelse: | CAP CER 3.3UF 25V X8R 1206 |
| kapasitans: | 3.3µF |
| applikasjoner: | Automotive |
| Email: | [email protected] |
Beslektede deler til CGA5L1X8R1E335K160AC
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CGA5L1X8R1E475K160AE | TDK Corporation | CAP CER 4.7UF 25V X8R 1206 | Forespørsel |
 |
CGA5L1X8R1E475K160AC | TDK Corporation | CAP CER 4.7UF 25V X8R 1206 | Forespørsel |
|
CGA5L1X8R1E335K160AD | TDK Corporation | CAP CER 3.3UF 25V X8R 1206 | Forespørsel |
|
CGA5L1X8R1E335K160AE | TDK Corporation | CAP CER 3.3UF 25V X8R 1206 | Forespørsel |
|
CGA5L1X8R1E475K160AD | TDK Corporation | CAP CER 4.7UF 25V X8R 1206 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog