Kjøpe CGA8N3X7R1C226M230KB med BYCHPS
Kjøp med garanti
CGA8N3X7R1C226M230KB
- Delenummer:
- CGA8N3X7R1C226M230KB
- Produsent:
- TDK Corporation
- Beskrivelse:
- CAP CER 22UF 16V X7R 1812
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19662 Pieces
Introduksjon
BYCHIPS er strømprodusenten for CGA8N3X7R1C226M230KB, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CGA8N3X7R1C226M230KB via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 16V |
|---|---|
| Toleranse: | ±20% |
| Tykkelse (Maks): | 0.091" (2.30mm) |
| Temperaturkoeffisient: | X7R |
| Størrelse / Dimensjon: | 0.177" L x 0.126" W (4.50mm x 3.20mm) |
| Serie: | CGA |
| rangeringer: | AEC-Q200 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 1812 (4532 Metric) |
| Andre navn: | 445-7911-2 CGA8N3X7R1C226M CGA8N3X7R1C226MT0Y0N |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount, MLCC |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | CGA8N3X7R1C226M230KB |
| Lead Style: | - |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Egenskaper: | - |
| Strykprosent: | - |
| Utvidet beskrivelse: | 22µF ±20% 16V Ceramic Capacitor X7R 1812 (4532 Metric) |
| Beskrivelse: | CAP CER 22UF 16V X7R 1812 |
| kapasitans: | 22µF |
| applikasjoner: | Automotive |
| Email: | [email protected] |
Beslektede deler til CGA8N3X7R1C226M230KB
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CGA8N3X7R2E474M230KE | TDK Corporation | CAP CER 0.47UF 250V X7R 1812 | Forespørsel |
|
CGA8N3X7R2E224K230KA | TDK Corporation | CAP CER 0.22UF 250V X7R 1812 | Forespørsel |
|
CGA8N3X7R2E334K230KA | TDK Corporation | CAP CER 0.33UF 250V X7R 1812 | Forespørsel |
|
CGA8N3X7S2A475K230KB | TDK Corporation | CAP CER 4.7UF 100V X7S 1812 | Forespørsel |
 |
CGA8N3X7R2E224M230KA | TDK Corporation | CAP CER 0.22UF 250V X7R 1812 | Forespørsel |
|
CGA8N3X7R2E334M230KA | TDK Corporation | CAP CER 0.33UF 250V X7R 1812 | Forespørsel |
|
CGA8N3X7R2E474M230KA | TDK Corporation | CAP CER 0.47UF 250V X7R 1812 | Forespørsel |
|
CGA8N3X7S2A475M230KB | TDK Corporation | CAP CER 4.7UF 100V X7S 1812 | Forespørsel |
|
CGA8N3X7R2E474K230KA | TDK Corporation | CAP CER 0.47UF 250V X7R 1812 | Forespørsel |
|
CGA8N3X7R2E474K230KE | TDK Corporation | CAP CER 0.47UF 250V X7R 1812 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers