Kjøpe CGA9L1X7S3A223M160KA med BYCHPS
Kjøp med garanti
CGA9L1X7S3A223M160KA
- Delenummer:
- CGA9L1X7S3A223M160KA
- Produsent:
- TDK Corporation
- Beskrivelse:
- CAP CER 0.022UF 1KV X7S 2220
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15369 Pieces
Introduksjon
BYCHIPS er strømprodusenten for CGA9L1X7S3A223M160KA, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CGA9L1X7S3A223M160KA via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 1000V (1kV) |
|---|---|
| Toleranse: | ±20% |
| Tykkelse (Maks): | 0.071" (1.80mm) |
| Temperaturkoeffisient: | X7S |
| Størrelse / Dimensjon: | 0.224" L x 0.197" W (5.70mm x 5.00mm) |
| Serie: | CGA |
| rangeringer: | AEC-Q200 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 2220 (5750 Metric) |
| Andre navn: | 445-13149-2 CGA9L1X7S3A223MT0Y0N |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount, MLCC |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | CGA9L1X7S3A223M160KA |
| Lead Style: | - |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Egenskaper: | - |
| Strykprosent: | - |
| Utvidet beskrivelse: | 0.022µF ±20% 1000V (1kV) Ceramic Capacitor X7S 2220 (5750 Metric) |
| Beskrivelse: | CAP CER 0.022UF 1KV X7S 2220 |
| kapasitans: | 0.022µF |
| applikasjoner: | Automotive |
| Email: | [email protected] |
Beslektede deler til CGA9L1X7S3A223M160KA
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog