Kjøpe CKG45NX7R1H335M500JJ med BYCHPS
Kjøp med garanti
CKG45NX7R1H335M500JJ
- Delenummer:
- CKG45NX7R1H335M500JJ
- Produsent:
- TDK Corporation
- Beskrivelse:
- CAP CER 3.3UF 50V X7R SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13346 Pieces
Introduksjon
BYCHIPS er strømprodusenten for CKG45NX7R1H335M500JJ, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CKG45NX7R1H335M500JJ via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 50V |
|---|---|
| Toleranse: | ±20% |
| Tykkelse (Maks): | 0.217" (5.50mm) |
| Temperaturkoeffisient: | X7R |
| Størrelse / Dimensjon: | 0.197" L x 0.138" W (5.00mm x 3.50mm) |
| Serie: | MEGACAP, CKG |
| rangeringer: | AEC-Q200 |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Stacked SMD, 2 J-Lead |
| Andre navn: | 445-10409-2 CKG45NX7R1H335MT0Y9W |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount, MLCC |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 18 Weeks |
| Produsentens varenummer: | CKG45NX7R1H335M500JJ |
| Lead Style: | J-Lead |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Egenskaper: | Low ESL (Stacked) |
| Strykprosent: | - |
| Utvidet beskrivelse: | 3.3µF ±20% 50V Ceramic Capacitor X7R Stacked SMD, 2 J-Lead |
| Beskrivelse: | CAP CER 3.3UF 50V X7R SMD |
| kapasitans: | 3.3µF |
| applikasjoner: | Automotive, SMPS Filtering, Bypass, Decoupling |
| Email: | [email protected] |
Beslektede deler til CKG45NX7R1H335M500JJ
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers