Kjøpe CL31B225KBHVPNE med BYCHPS
Kjøp med garanti
CL31B225KBHVPNE
- Delenummer:
- CL31B225KBHVPNE
- Produsent:
- Samsung Electro-Mechanics America, Inc.
- Beskrivelse:
- CAP CER 2.2UF 50V X7R 1206
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16215 Pieces
- Dataark:
- CL31B225KBHVPNE.pdf
Introduksjon
BYCHIPS er strømprodusenten for CL31B225KBHVPNE, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CL31B225KBHVPNE via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 50V |
|---|---|
| Toleranse: | ±10% |
| Tykkelse (Maks): | 0.071" (1.80mm) |
| Temperaturkoeffisient: | X7R |
| Størrelse / Dimensjon: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Serie: | CL |
| rangeringer: | AEC-Q200 |
| emballasje: | Original-Reel® |
| Pakke / tilfelle: | 1206 (3216 Metric) |
| Andre navn: | 1276-6735-6 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount, MLCC |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | CL31B225KBHVPNE |
| Lead Style: | - |
| Lead Spacing: | - |
| Høyde - sittende (maks): | - |
| Egenskaper: | Soft Termination |
| Utvidet beskrivelse: | 2.2µF ±10% 50V Ceramic Capacitor X7R 1206 (3216 Metric) |
| Beskrivelse: | CAP CER 2.2UF 50V X7R 1206 |
| kapasitans: | 2.2µF |
| applikasjoner: | Automotive, Boardflex Sensitive |
| Email: | [email protected] |
Beslektede deler til CL31B225KBHVPNE
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog