Kjøpe CSSTV32867SGKEREP med BYCHPS
Kjøp med garanti
CSSTV32867SGKEREP
- Delenummer:
- CSSTV32867SGKEREP
- Produsent:
- Beskrivelse:
- IC REGISTERED BUFF 26BIT 96LFBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19484 Pieces
- Dataark:
- CSSTV32867SGKEREP.pdf
Introduksjon
BYCHIPS er strømprodusenten for CSSTV32867SGKEREP, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CSSTV32867SGKEREP via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Forsyningsspenningen: | 2.3 V ~ 2.7 V |
|---|---|
| Leverandør Enhetspakke: | 96-LFBGA (13.5x5.5) |
| Serie: | 74SSTV |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 96-LFBGA |
| Andre navn: | 296-22147-2 V62/06676-01XE |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall bit: | 26 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | CSSTV32867SGKEREP |
| Logikk Type: | Registered Buffer with SSTL_2 Compatible I/O for DDR |
| Utvidet beskrivelse: | Registered Buffer with SSTL_2 Compatible I/O for DDR IC 96-LFBGA (13.5x5.5) |
| Beskrivelse: | IC REGISTERED BUFF 26BIT 96LFBGA |
| Email: | [email protected] |
Beslektede deler til CSSTV32867SGKEREP
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
|
CSSTV32852GKFREP | Texas Instruments | IC REGISTERED BUFF 114LFBGA | Forespørsel |
 |
74SSTVF16857PAG | IDT, Integrated Device Technology Inc | IC BUFFER 14BIT SSTL I/O 48TSSOP | Forespørsel |
 |
SY10EL16VBKG | Microchip Technology | IC RCVR DIFF 3.3/5V 8-MSOP | Forespørsel |
|
SSTV16859CGLFT | IDT, Integrated Device Technology Inc | IC BUS DVR UNIV 13-26BIT 64TSSOP | Forespørsel |
 |
ISL55100AIRZ-T | Intersil | IC COMP DRVR/WINDOW 18V 72-QFN | Forespørsel |
|
SN74ACT1073DW | Texas Instruments | IC 16-BIT BUS TERM ARRAY 20-SOIC | Forespørsel |
 |
SSTU32865ET,557 | NXP USA Inc. | IC BUFFER 1.8V 28BIT SOT802-1 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers