Kjøpe CYD09S72V18-200BGXI med BYCHPS
Kjøp med garanti
CYD09S72V18-200BGXI
- Delenummer:
- CYD09S72V18-200BGXI
- Produsent:
- Cypress Semiconductor
- Beskrivelse:
- IC SRAM 9MBIT 200MHZ 484FBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19442 Pieces
- Dataark:
- CYD09S72V18-200BGXI.pdf
Introduksjon
BYCHIPS er strømprodusenten for CYD09S72V18-200BGXI, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CYD09S72V18-200BGXI via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V |
|---|---|
| Leverandør Enhetspakke: | 484-FBGA (23x23) |
| Hastighet: | 200MHz |
| Serie: | - |
| emballasje: | Tray |
| Pakke / tilfelle: | 484-FBGA |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Minnetype: | Volatile |
| Minnestørrelse: | 9Mb (128K x 72) |
| Minneformat: | SRAM |
| Produsentens varenummer: | CYD09S72V18-200BGXI |
| Interface: | Parallel |
| Beskrivelse: | IC SRAM 9MBIT 200MHZ 484FBGA |
| Email: | [email protected] |
Beslektede deler til CYD09S72V18-200BGXI
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CYD09S72V18-167BBXI | Cypress Semiconductor Corp | IC SRAM 9MBIT 167MHZ 256FBGA | Forespørsel |
 |
CYD09S72V-167BBC | Cypress Semiconductor Corp | IC SRAM 9MBIT 167MHZ 484FBGA | Forespørsel |
|
CYD09S72V18-250BBXC | Cypress Semiconductor Corp | IC SRAM 9MBIT 250MHZ 256FBGA | Forespørsel |
|
CYD09S72V-133BBC | Cypress Semiconductor Corp | IC SRAM 9MBIT 133MHZ 484FBGA | Forespørsel |
|
CYD09S72V18-167BBXC | Cypress Semiconductor Corp | IC SRAM 9MBIT 167MHZ 256FBGA | Forespørsel |
|
CYD09S72V18-200BBXC | Cypress Semiconductor Corp | IC SRAM 9MBIT 200MHZ 256FBGA | Forespørsel |
|
CYD09S72V18-200BBXI | Cypress Semiconductor Corp | IC SRAM 9MBIT 200MHZ 256FBGA | Forespørsel |
|
CYD09S72V-133BBI | Cypress Semiconductor Corp | IC SRAM 9MBIT 133MHZ 484FBGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers