Kjøpe DEBB33F332KA3B med BYCHPS
Kjøp med garanti
DEBB33F332KA3B
- Delenummer:
- DEBB33F332KA3B
- Produsent:
- Murata Electronics
- Beskrivelse:
- CAP CER 3300PF 3.15KV RADIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18880 Pieces
- Dataark:
- DEBB33F332KA3B.pdf
Introduksjon
BYCHIPS er strømprodusenten for DEBB33F332KA3B, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DEBB33F332KA3B via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 3150V (3.15kV) |
|---|---|
| Toleranse: | ±10% |
| Tykkelse (Maks): | - |
| Temperaturkoeffisient: | B |
| Størrelse / Dimensjon: | 0.591" Dia (15.00mm) |
| Serie: | DEB |
| rangeringer: | - |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Disc |
| Andre navn: | 490-4287 |
| Driftstemperatur: | -25°C ~ 85°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | DEBB33F332KA3B |
| Lead Style: | Formed Leads |
| Lead Spacing: | 0.295" (7.50mm) |
| Høyde - sittende (maks): | 0.709" (18.00mm) |
| Egenskaper: | High Voltage |
| Utvidet beskrivelse: | 3300pF ±10% 3150V (3.15kV) Ceramic Capacitor B Radial, Disc |
| Beskrivelse: | CAP CER 3300PF 3.15KV RADIAL |
| kapasitans: | 3300pF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til DEBB33F332KA3B
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers