Kjøpe DS24B33+ med BYCHPS
Kjøp med garanti
DS24B33+
- Delenummer:
- DS24B33+
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC EEPROM 4KBIT 1WIRE TO92-3
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14193 Pieces
- Dataark:
- 1.DS24B33+.pdf2.DS24B33+.pdf
Introduksjon
BYCHIPS er strømprodusenten for DS24B33+, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DS24B33+ via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.8 V ~ 5.25 V |
|---|---|
| Leverandør Enhetspakke: | TO-92-3 |
| Hastighet: | - |
| Serie: | - |
| emballasje: | Bulk |
| Pakke / tilfelle: | TO-226-3, TO-92-3 (TO-226AA) |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Minnetype: | Non-Volatile |
| Minnestørrelse: | 4Kb (256 x 16) |
| Minneformat: | EEPROM |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | DS24B33+ |
| Interface: | 1-Wire® Serial |
| Beskrivelse: | IC EEPROM 4KBIT 1WIRE TO92-3 |
| Email: | [email protected] |
Beslektede deler til DS24B33+
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
DS24B33+T&R | Maxim Integrated | IC EEPROM 4KBIT 1WIRE TO92-3 | Forespørsel |
 |
DS24B33G+U | Maxim Integrated | IC EEPROM 4KBIT 1WIRE 2SFN | Forespørsel |
 |
DS24B33S+T&R | Maxim Integrated | IC EEPROM 4KBIT 1WIRE 8SO | Forespørsel |
 |
DS24B33Q+U | Maxim Integrated | IC EEPROM 4KBIT 1WIRE 6TDFN | Forespørsel |
|
DS24B33Q+T&R | Maxim Integrated | IC EEPROM 4KBIT 1WIRE 6TDFN | Forespørsel |
|
DS24B33S+ | Maxim Integrated | IC EEPROM 4KBIT 1WIRE 8SO | Forespørsel |
|
DS24B33G+T&R | Maxim Integrated | IC EEPROM 4KBIT 1WIRE 2SFN | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers