Kjøpe DS26401A2 med BYCHPS
Kjøp med garanti
DS26401A2
- Delenummer:
- DS26401A2
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC FRAMER OCTAL T1/E1 CSBGA
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 12749 Pieces
- Dataark:
- DS26401A2.pdf
Introduksjon
BYCHIPS er strømprodusenten for DS26401A2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DS26401A2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3.135 V ~ 3.465 V |
|---|---|
| Leverandør Enhetspakke: | 256-CSBGA (17x17) |
| Serie: | - |
| Strøm (Watts): | - |
| emballasje: | Tray |
| Pakke / tilfelle: | 256-LBGA, CSBGA |
| Driftstemperatur: | 0°C ~ 70°C |
| Antall kretser: | 8 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | DS26401A2 |
| Interface: | WAN |
| inkluderer: | - |
| Funksjon: | - |
| Utvidet beskrivelse: | Telecom IC 256-CSBGA (17x17) |
| Beskrivelse: | IC FRAMER OCTAL T1/E1 CSBGA |
| Strøm - Forsyning: | 275mA |
| Email: | [email protected] |
Beslektede deler til DS26401A2
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
LE78D110BVC | Microsemi Corporation | IC CODEC 2CH VOSLIC DTMF 44TQFP | Forespørsel |
 |
DS26401A2+ | Maxim Integrated | IC OCTAL FRAMER T1/E1/J1 256BGA | Forespørsel |
 |
DS26401 | Maxim Integrated | IC FRAMER OCTAL T1/E1 CSBGA | Forespørsel |
|
DS26401NA2 | Maxim Integrated | IC FRAMER OCTAL T1/E1 CSBGA | Forespørsel |
|
DS26401+ | Maxim Integrated | IC OCTAL FRAMER T1/E1/J1 256BGA | Forespørsel |
|
DS26401N+ | Maxim Integrated | IC OCTAL FRAMER T1/E1/J1 256-BGA | Forespørsel |
|
DS26401NA2+ | Maxim Integrated | IC OCTAL FRAMER T1/E1/J1 256BGA | Forespørsel |
 |
U4091BMC-RFNG3Y-19 | Microchip Technology | IC TELE AUDIO PROCESSOR 44SSO | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog