Kjøpe DS34S132GN med BYCHPS
Kjøp med garanti
DS34S132GN
- Delenummer:
- DS34S132GN
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC TDM/PACKET TRANSPORT 676BGA
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 17542 Pieces
- Dataark:
- DS34S132GN.pdf
Introduksjon
BYCHIPS er strømprodusenten for DS34S132GN, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DS34S132GN via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 1.8V, 3.3V |
|---|---|
| Leverandør Enhetspakke: | 676-PBGA (27x27) |
| Serie: | - |
| Strøm (Watts): | - |
| emballasje: | Tray |
| Pakke / tilfelle: | 676-BGA |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall kretser: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | DS34S132GN |
| Interface: | TDMoP |
| inkluderer: | - |
| Funksjon: | TDM-over-Packet (TDMoP) |
| Utvidet beskrivelse: | Telecom IC TDM-over-Packet (TDMoP) 676-PBGA (27x27) |
| Beskrivelse: | IC TDM/PACKET TRANSPORT 676BGA |
| Strøm - Forsyning: | - |
| Email: | [email protected] |
Beslektede deler til DS34S132GN
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
DS34S108GN+ | Maxim Integrated | IC TRANSPORT TDM 484BGA | Forespørsel |
 |
DS34S104GN+ | Maxim Integrated | IC TRANSPORT TDM 256CSBGA | Forespørsel |
 |
DS34S132GNA2+ | Maxim Integrated | IC 32PORT TDM OVER PACKET 676BGA | Forespørsel |
|
DS34S101GN | Maxim Integrated | IC TRANSPORT TDM/PACKET 256CSBGA | Forespørsel |
|
DS34S132GN+ | Maxim Integrated | IC TDM OVER PACKET 676-BGA | Forespørsel |
 |
DS34S101GN+ | Maxim Integrated | IC TRANSPORT TDM SGL 256-CSBGA | Forespørsel |
 |
DS34S102GN+ | Maxim Integrated | IC TRANSPORT TDM DUAL 256-CSBGA | Forespørsel |
|
DS34S104GN | Maxim Integrated | IC TRANSPORT TDM/PACKET 256CSBGA | Forespørsel |
|
DS34S102GN | Maxim Integrated | IC TRANSPORT TDM/PACKET 256CSBGA | Forespørsel |
|
DS34S108GN | Maxim Integrated | IC TDM/PACKET TRANSPORT | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog