Kjøpe DS34T104GN+ med BYCHPS
Kjøp med garanti
DS34T104GN+
- Delenummer:
- DS34T104GN+
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC TDM OVER PACKET 484BGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17503 Pieces
- Dataark:
- DS34T104GN+.pdf
Introduksjon
BYCHIPS er strømprodusenten for DS34T104GN+, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DS34T104GN+ via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | TDM (Time Division Multiplexing) |
|---|---|
| Leverandør Enhetspakke: | 484-TEBGA (23x23) |
| Serie: | - |
| emballasje: | Tray |
| Pakke / tilfelle: | 484-BGA |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 5 (48 Hours) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | DS34T104GN+ |
| Utvidet beskrivelse: | TDM (Time Division Multiplexing) IC Data Transport 484-TEBGA (23x23) |
| Beskrivelse: | IC TDM OVER PACKET 484BGA |
| applikasjoner: | Data Transport |
| Email: | [email protected] |
Beslektede deler til DS34T104GN+
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
DS34T108GN+ | Maxim Integrated | IC TDM OVER PACKET 484HSBGA | Forespørsel |
 |
DS34T101GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Forespørsel |
|
DS34T104GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Forespørsel |
|
DS34T101GN+ | Maxim Integrated | IC TDM OVER PACKET 484BGA | Forespørsel |
|
DS34T102GN+ | Maxim Integrated | IC TDM OVER PACKET 484BGA | Forespørsel |
|
DS34T108GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Forespørsel |
|
DS34T102GN | Maxim Integrated | IC TDM/PACKET CHIP 484-BGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers