Kjøpe DS8500-JND+T&R med BYCHPS
Kjøp med garanti
DS8500-JND+T&R
- Delenummer:
- DS8500-JND+T&R
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC MODEM HART SGL 3.6V 20-TQFN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18786 Pieces
- Dataark:
- DS8500-JND+T&R.pdf
Introduksjon
BYCHIPS er strømprodusenten for DS8500-JND+T&R, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DS8500-JND+T&R via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.7 V ~ 3.6 V |
|---|---|
| Leverandør Enhetspakke: | 20-TQFN-EP (5x5) |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 20-WQFN Exposed Pad |
| Andre navn: | DS8500-JND+T&R-ND DS8500-JND+TR |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | DS8500-JND+T&R |
| Interface: | Serial |
| Utvidet beskrivelse: | HART Modem Interface 20-TQFN-EP (5x5) |
| Beskrivelse: | IC MODEM HART SGL 3.6V 20-TQFN |
| applikasjoner: | HART Modem |
| Email: | [email protected] |
Beslektede deler til DS8500-JND+T&R
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
TDA8007BHL/C3,118 | NXP USA Inc. | IC INTERFACE CARD MP 48-LQFP | Forespørsel |
 |
MLX81150LLW-DAA-000-RE | Melexis Technologies NV | IC LIN SLAVE 32K FLASH 32QFN | Forespørsel |
 |
DS8500-JND+ | Maxim Integrated | IC MODEM HART SGL 3.6V 20-TQFN | Forespørsel |
 |
Z8523016PEC | Zilog | IC 16MHZ ESCC XTEMP 40-DIP | Forespørsel |
 |
IP4776CZ38,118 | NXP USA Inc. | IC HDMI INTERFACE 38TSSOP | Forespørsel |
 |
MCZ33905CS3EKR2 | NXP USA Inc. | IC SBC CAN HS 3.3V 32SOIC | Forespørsel |
|
TDA8007BHL/C4,118 | NXP USA Inc. | IC INTERFACE CARD MP 48LQFP | Forespørsel |
 |
PCI9080-3 G | Broadcom Limited | PCI9080-3 G | Forespørsel |
 |
89HPES6T5ZBBCI | IDT, Integrated Device Technology Inc | IC PCIE SW 6LANE 5PORT 196CABGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers