Kjøpe DSPIC33EV128GM006-I/MR med BYCHPS
Kjøp med garanti
DSPIC33EV128GM006-I/MR
- Delenummer:
- DSPIC33EV128GM006-I/MR
- Produsent:
- Micrel / Microchip Technology
- Beskrivelse:
- IC MCU 16BIT 128KB FLASH 64QFN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12252 Pieces
Introduksjon
BYCHIPS er strømprodusenten for DSPIC33EV128GM006-I/MR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DSPIC33EV128GM006-I/MR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning (Vcc / Vdd): | 4.5 V ~ 5.5 V |
|---|---|
| Leverandør Enhetspakke: | 64-QFN (9x9) |
| Hastighet: | 70 MIPs |
| Serie: | dsPIC™ 33EV |
| RAM-størrelse: | 8K x 8 |
| Programminnetype: | FLASH |
| Programminnestørrelse: | 128KB (43K x 24) |
| periferi~~POS=TRUNC: | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| emballasje: | Tube |
| Pakke / tilfelle: | 64-VFQFN Exposed Pad |
| Oscillator type: | Internal |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antall I / O: | 53 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | DSPIC33EV128GM006-I/MR |
| Utvidet beskrivelse: | dsPIC dsPIC™ 33EV Microcontroller IC 16-Bit 70 MIPs 128KB (43K x 24) FLASH 64-QFN (9x9) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 16BIT 128KB FLASH 64QFN |
| Datakonvertere: | A/D 36x10/12b |
| Kjernestørrelse: | 16-Bit |
| Kjerneprosessor: | dsPIC |
| tilkobling: | I²C, IrDA, LIN, SPI, UART/USART |
| Email: | [email protected] |
Beslektede deler til DSPIC33EV128GM006-I/MR
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers