Kjøpe DZH-2R5D307S57T med BYCHPS
Kjøp med garanti
DZH-2R5D307S57T
- Delenummer:
- DZH-2R5D307S57T
- Produsent:
- Elna America
- Beskrivelse:
- CAP 300F -20% +80% 2.5V T/H
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16887 Pieces
- Dataark:
- DZH-2R5D307S57T.pdf
Introduksjon
BYCHIPS er strømprodusenten for DZH-2R5D307S57T, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DZH-2R5D307S57T via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.5V |
|---|---|
| Toleranse: | -20%, +80% |
| Avslutning: | Through Hole |
| Størrelse / Dimensjon: | 1.378" Dia (35.00mm) |
| Serie: | DZH |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can - Snap-In |
| Andre navn: | 604-1091 DZ-2R5D307S57T |
| Driftstemperatur: | -25°C ~ 60°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 18 Weeks |
| Produsentens varenummer: | DZH-2R5D307S57T |
| Levetid @ Temp.: | 2000 Hrs @ 60°C |
| Lead Spacing: | 0.394" (10.00mm) |
| Høyde - sittende (maks): | 2.047" (52.00mm) |
| Utvidet beskrivelse: | 300F -20%, +80%(EDLC) Supercapacitor 2.5V Radial, Can - Snap-In 80 mOhm 2000 Hrs @ 60°C |
| ESR (ekvivalent serieresistens): | 80 mOhm |
| Beskrivelse: | CAP 300F -20% +80% 2.5V T/H |
| kapasitans: | 300F |
| Email: | [email protected] |
Beslektede deler til DZH-2R5D307S57T
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
EDLNF104A5R5C | Cornell Dubilier Electronics (CDE) | CAP 100MF 5.5V THROUGH HOLE | Forespørsel |
 |
MAL219622104E3 | Vishay BC Components | CAP 100MF -20%, +80% 5.5V T/H | Forespørsel |
 |
FG0H225ZF | KEMET | CAP 2.2F -20% +80% 5.5V T/H | Forespørsel |
 |
TV1840-3R0606-R | Eaton | CAP, 3.0V, 60F | Forespørsel |
 |
HB1860-2R5117-R | Eaton | CAP 110F -10% +30% 2.5V T/H | Forespørsel |
 |
B48621A7205Q018 | EPCOS (TDK) | CAP 200F -10% +30% 42V CHAS MNT | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers