Kjøpe E74D350HPN812MA54N med BYCHPS
Kjøp med garanti
E74D350HPN812MA54N
- Delenummer:
- E74D350HPN812MA54N
- Produsent:
- Nippon Chemi-Con
- Beskrivelse:
- CAP ALUM 8100UF 35V SCREW
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14219 Pieces
- Dataark:
- E74D350HPN812MA54N.pdf
Introduksjon
BYCHIPS er strømprodusenten for E74D350HPN812MA54N, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for E74D350HPN812MA54N via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | U74D |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | E74D350HPN812MA54N |
| Utvidet beskrivelse: | Aluminum Capacitors |
| Beskrivelse: | CAP ALUM 8100UF 35V SCREW |
| Email: | [email protected] |
Beslektede deler til E74D350HPN812MA54N
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
E74D350LPN482MA41M | United Chemi-Con | CAP ALUM 4800UF 20% 35V SCREW | Forespørsel |
 |
E74D350HPN363MC92N | United Chemi-Con | CAP ALUM 36000UF 35V SCREW | Forespørsel |
|
E74D350LPN113MA67M | United Chemi-Con | CAP ALUM 11000UF 35V SCREW | Forespørsel |
|
E74D350LPN143MA79N | United Chemi-Con | CAP ALUM 14000UF 35V SCREW | Forespørsel |
|
E74D350LPN902WAA5M | United Chemi-Con | CAP ALUM 9000UF 35V SCREW | Forespørsel |
|
E74D350LPN143MA80M | United Chemi-Con | CAP ALUM 14000UF 35V SCREW | Forespørsel |
|
E74D350LPN293MC80M | United Chemi-Con | CAP ALUM 29000UF 35V SCREW | Forespørsel |
|
E74D350LPN812MA54N | United Chemi-Con | CAP ALUM 8100UF 35V SCREW | Forespørsel |
|
E74D350LPN303MAE3N | United Chemi-Con | CAP ALUM 30000UF 35V SCREW | Forespørsel |
|
E74D350LPN482MA41N | United Chemi-Con | CAP ALUM 4800UF 20% 35V SCREW | Forespørsel |
|
E74D350HPN293MC80M | United Chemi-Con | CAP ALUM 29000UF 35V SCREW | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog