Kjøpe ECW-U2274KCV med BYCHPS
Kjøp med garanti
ECW-U2274KCV
- Delenummer:
- ECW-U2274KCV
- Produsent:
- Panasonic
- Beskrivelse:
- CAP FILM 0.27UF 10% 250VDC 3925
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15787 Pieces
- Dataark:
- ECW-U2274KCV.pdf
Introduksjon
BYCHIPS er strømprodusenten for ECW-U2274KCV, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ECW-U2274KCV via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 250V |
|---|---|
| Spenningsverdier - AC: | - |
| Toleranse: | ±10% |
| Avslutning: | Solder Pads |
| Størrelse / Dimensjon: | 0.386" L x 0.248" W (9.80mm x 6.30mm) |
| Serie: | ECW-U(C) |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 3925 (9863 Metric) |
| Andre navn: | ECWU2274KCV PCF1276TR |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 4 (72 Hours) |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | ECW-U2274KCV |
| Lead Spacing: | - |
| Høyde - sittende (maks): | 0.161" (4.10mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 0.27µF ±10% Film Capacitor 250V Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked 3925 (9863 Metric) |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked |
| Beskrivelse: | CAP FILM 0.27UF 10% 250VDC 3925 |
| kapasitans: | 0.27µF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til ECW-U2274KCV
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers