Kjøpe EP2AGZ300FH29I3N med BYCHPS
Kjøp med garanti
EP2AGZ300FH29I3N
- Delenummer:
- EP2AGZ300FH29I3N
- Produsent:
- Altera (Intel)
- Beskrivelse:
- IC FPGA 281 I/O 780HBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12490 Pieces
Introduksjon
BYCHIPS er strømprodusenten for EP2AGZ300FH29I3N, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for EP2AGZ300FH29I3N via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 0.87 V ~ 0.93 V |
|---|---|
| Totalt RAM-bit: | 18854912 |
| Leverandør Enhetspakke: | 780-HBGA (33x33) |
| Serie: | Arria II GZ |
| Pakke / tilfelle: | 780-BBGA, FCBGA |
| Driftstemperatur: | -40°C ~ 100°C (TJ) |
| Antall logiske elementer / celler: | 298000 |
| Antall LAB / CLBer: | 11920 |
| Antall I / O: | 281 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | EP2AGZ300FH29I3N |
| Beskrivelse: | IC FPGA 281 I/O 780HBGA |
| Email: | [email protected] |
Beslektede deler til EP2AGZ300FH29I3N
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
EP2AGZ300FH29C3N | Altera | IC FPGA 281 I/O 780HBGA | Forespørsel |
|
EP2AGZ300FH29I4N | Altera | IC FPGA 281 I/O 780HBGA | Forespørsel |
 |
EP2AGZ300FF35C4N | Altera | IC FPGA 554 I/O 1152FBGA | Forespørsel |
|
EP2AGZ300FH29C4N | Altera | IC FPGA 281 I/O 780HBGA | Forespørsel |
|
EP2AGZ300FF35I3N | Altera | IC FPGA 554 I/O 1152FBGA | Forespørsel |
 |
EP2AGZ300HF40I4N | Altera | IC FPGA 734 I/O 1517FBGA | Forespørsel |
|
EP2AGZ300HF40C3N | Altera | IC FPGA 734 I/O 1517FBGA | Forespørsel |
|
EP2AGZ300HF40I3N | Altera | IC FPGA 734 I/O 1517FBGA | Forespørsel |
|
EP2AGZ300FF35I4N | Altera | IC FPGA 554 I/O 1152FBGA | Forespørsel |
|
EP2AGZ300HF40C4N | Altera | IC FPGA 734 I/O 1517FBGA | Forespørsel |
|
EP2AGZ300FF35C3N | Altera | IC FPGA 554 I/O 1152FBGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers