Kjøpe EPF6016ATC144-1 med BYCHPS
Kjøp med garanti
EPF6016ATC144-1
- Delenummer:
- EPF6016ATC144-1
- Produsent:
- Altera (Intel)
- Beskrivelse:
- IC FPGA 117 I/O 144TQFP
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 13695 Pieces
Introduksjon
BYCHIPS er strømprodusenten for EPF6016ATC144-1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for EPF6016ATC144-1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Leverandør Enhetspakke: | 144-TQFP (20x20) |
| Serie: | FLEX 6000 |
| Pakke / tilfelle: | 144-LQFP |
| Driftstemperatur: | 0°C ~ 85°C (TJ) |
| Antall logiske elementer / celler: | 1320 |
| Antall LAB / CLBer: | 132 |
| Antall I / O: | 117 |
| Antall porte: | 16000 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | EPF6016ATC144-1 |
| Beskrivelse: | IC FPGA 117 I/O 144TQFP |
| Email: | [email protected] |
Beslektede deler til EPF6016ATC144-1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
EPF6016ATC144-2 | Altera | IC FPGA 117 I/O 144TQFP | Forespørsel |
|
EPF6016ATC144-2N | Altera | IC FPGA 117 I/O 144TQFP | Forespørsel |
|
EPF6016ATC144-1N | Altera | IC FPGA 117 I/O 144TQFP | Forespørsel |
|
EPF6016ATC100-3N | Altera | IC FPGA 81 I/O 100TQFP | Forespørsel |
|
EPF6016ATC144-3N | Altera | IC FPGA 117 I/O 144TQFP | Forespørsel |
|
EPF6016ATC100-1 | Altera | IC FPGA 81 I/O 100TQFP | Forespørsel |
|
EPF6016ATC144-3 | Altera | IC FPGA 117 I/O 144TQFP | Forespørsel |
|
EPF6016ATC100-2 | Altera | IC FPGA 81 I/O 100TQFP | Forespørsel |
|
EPF6016ATC100-3 | Altera | IC FPGA 81 I/O 100TQFP | Forespørsel |
|
EPF6016ATC100-2N | Altera | IC FPGA 81 I/O 100TQFP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers