Kjøpe F17724392166 med BYCHPS
Kjøp med garanti
F17724392166
- Delenummer:
- F17724392166
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- CAP FILM 0.39UF 5% 630VDC RADIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15367 Pieces
- Dataark:
- F17724392166.pdf
Introduksjon
BYCHIPS er strømprodusenten for F17724392166, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for F17724392166 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 630V |
|---|---|
| Spenningsverdier - AC: | 310V |
| Toleranse: | ±5% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 1.220" L x 0.433" W (31.00mm x 11.00mm) |
| Serie: | F1772 |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial |
| Andre navn: | 17724392166 |
| Driftstemperatur: | -40°C ~ 110°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | F17724392166 |
| Lead Spacing: | 0.886" (22.50mm) |
| Høyde - sittende (maks): | 0.828" (21.00mm) |
| Egenskaper: | X2 Safety Rated |
| Utvidet beskrivelse: | 0.39µF ±5% Film Capacitor 310V 630V Polyester, Metallized Radial |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polyester, Metallized |
| Beskrivelse: | CAP FILM 0.39UF 5% 630VDC RADIAL |
| kapasitans: | 0.39µF |
| applikasjoner: | EMI, RFI Suppression |
| Email: | [email protected] |
Beslektede deler til F17724392166
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog