Kjøpe FB73-287 med BYCHPS
Kjøp med garanti
FB73-287
- Delenummer:
- FB73-287
- Produsent:
- Bourns, Inc.
- Beskrivelse:
- FERRITE CORE SOLID 2.64MM
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 12722 Pieces
- Dataark:
- FB73-287.pdf
Introduksjon
BYCHIPS er strømprodusenten for FB73-287, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FB73-287 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Round |
|---|---|
| Serie: | FB |
| rangeringer: | - |
| Ytre dimensjon: | 0.311" Dia (7.89mm) |
| Andre navn: | M2310 |
| Monteringstype: | Free Hanging |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale: | 73 |
| Produsentens varenummer: | FB73-287 |
| Lengde: | 0.312" (7.92mm) |
| Innvendig dimensjon: | 0.104" Dia (2.64mm) |
| Impedans @ Frekvens: | - |
| Utvidet beskrivelse: | Solid Free Hanging Ferrite Core ID 0.104" Dia (2.64mm) OD 0.311" Dia (7.89mm) Length 0.312" (7.92mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE SOLID 2.64MM |
| Email: | [email protected] |
Beslektede deler til FB73-287
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
FB73-422-RC | Bourns Inc. | FERRITE CORE SOLID 1.77MM | Forespørsel |
 |
FB73-287-RC | Bourns Inc. | FERRITE CORE SOLID 2.64MM | Forespørsel |
|
FB73-422 | Bourns Inc. | FERRITE CORE SOLID 1.77MM | Forespørsel |
 |
FB73-226-RC | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Forespørsel |
|
FB73-226 | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Forespørsel |
 |
ZCAT2017-0930B-M | TDK Corporation | FERRITE CORE 50 OHM HINGED 9MM | Forespørsel |
 |
FB73-110 | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Forespørsel |
|
FB73-110-RC | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Forespørsel |
 |
FB73-085 | Bourns Inc. | FERRITE CORE SOLID 0.78MM | Forespørsel |
|
FB73-085-RC | Bourns Inc. | FERRITE CORE SOLID 0.78MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers