Kjøpe FDD26AN06A0_F085 med BYCHPS
Kjøp med garanti
FDD26AN06A0_F085
- Delenummer:
- FDD26AN06A0_F085
- Produsent:
- Fairchild/ON Semiconductor
- Beskrivelse:
- MOSFET N-CH 60V 7A DPAK-3
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13323 Pieces
- Dataark:
- FDD26AN06A0_F085.pdf
Introduksjon
BYCHIPS er strømprodusenten for FDD26AN06A0_F085, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FDD26AN06A0_F085 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | 4V @ 250µA |
|---|---|
| Vgs (maks): | ±20V |
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Enhetspakke: | TO-252AA |
| Serie: | Automotive, AEC-Q101, PowerTrench® |
| Rds På (Maks) @ Id, Vgs: | 26 mOhm @ 36A, 10V |
| Strømdissipasjon (maks): | 75W (Tc) |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Andre navn: | FDD26AN06A0_F085-ND FDD26AN06A0_F085TR |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 28 Weeks |
| Produsentens varenummer: | FDD26AN06A0_F085 |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 800pF @ 25V |
| Gateavgift (Qg) (Maks) @ Vgs: | 17nC @ 10V |
| FET Type: | N-Channel |
| FET-funksjonen: | - |
| Utvidet beskrivelse: | N-Channel 60V 7A (Ta), 36A (Tc) 75W (Tc) Surface Mount TO-252AA |
| Drivspenning (Maks. Rds På, Min Rds På): | 10V |
| Drain til Source Voltage (VDSS): | 60V |
| Beskrivelse: | MOSFET N-CH 60V 7A DPAK-3 |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 7A (Ta), 36A (Tc) |
| Email: | [email protected] |
Beslektede deler til FDD26AN06A0_F085
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers