Kjøpe FFA60UA60DN med BYCHPS
Kjøp med garanti
FFA60UA60DN
- Delenummer:
- FFA60UA60DN
- Produsent:
- Fairchild/ON Semiconductor
- Beskrivelse:
- DIODE ARRAY GP 600V 30A TO3PN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15422 Pieces
- Dataark:
- FFA60UA60DN.pdf
Introduksjon
BYCHIPS er strømprodusenten for FFA60UA60DN, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FFA60UA60DN via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 2.2V @ 30A |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 600V |
| Leverandør Enhetspakke: | TO-3P |
| Hastighet: | Fast Recovery = 200mA (Io) |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 90ns |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-3P-3, SC-65-3 |
| Driftstemperatur - Kobling: | -65°C ~ 150°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | FFA60UA60DN |
| Utvidet beskrivelse: | Diode Array 1 Pair Common Cathode Standard 600V 30A Through Hole TO-3P-3, SC-65-3 |
| Diodetype: | Standard |
| Diode Konfigurasjon: | 1 Pair Common Cathode |
| Beskrivelse: | DIODE ARRAY GP 600V 30A TO3PN |
| Strøm - Omvendt lekkasje @ Vr: | 100µA @ 600V |
| Gjeldende - Gjennomsnittlig Rectified (Io) (per diode): | 30A |
| Email: | [email protected] |
Beslektede deler til FFA60UA60DN
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog