Kjøpe FFB5551 med BYCHPS
Kjøp med garanti
FFB5551
- Delenummer:
- FFB5551
- Produsent:
- Fairchild/ON Semiconductor
- Beskrivelse:
- TRANS 2NPN 160V 0.2A SC70-6
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18247 Pieces
- Dataark:
- FFB5551.pdf
Introduksjon
BYCHIPS er strømprodusenten for FFB5551, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FFB5551 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 160V |
|---|---|
| Vce Metning (Maks) @ Ib, Ic: | 200mV @ 5mA, 50mA |
| Transistor Type: | 2 NPN (Dual) |
| Leverandør Enhetspakke: | SC-70-6 |
| Serie: | - |
| Strøm - Maks: | 200mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 6-TSSOP, SC-88, SOT-363 |
| Andre navn: | FFB5551-ND FFB5551TR |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 25 Weeks |
| Produsentens varenummer: | FFB5551 |
| Frekvens - Overgang: | 300MHz |
| Utvidet beskrivelse: | Bipolar (BJT) Transistor Array 2 NPN (Dual) 160V 200mA 300MHz 200mW Surface Mount SC-70-6 |
| Beskrivelse: | TRANS 2NPN 160V 0.2A SC70-6 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 80 @ 10mA, 5V |
| Gjeldende - Samler Cutoff (Maks): | 50nA (ICBO) |
| Nåværende - Samler (Ic) (Maks): | 200mA |
| Email: | [email protected] |
Beslektede deler til FFB5551
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
DMG904010R | Panasonic Electronic Components | TRANS NPN/PNP 50V 0.1A SSMINI6 | Forespørsel |
 |
DMMT5551-7-F | Diodes Incorporated | TRANS 2NPN 160V 0.2A SOT26 | Forespørsel |
 |
2N3811A | Central Semiconductor Corp | TRANS 2PNP 50MA 60V TO78-6 | Forespørsel |
 |
EMX52T2R | Rohm Semiconductor | TRANS 2NPN 50V 0.1A EMT6 | Forespørsel |
 |
SNST3904DXV6T5G | ON Semiconductor | TRANS 2NPN 40V 0.2A SOT563 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers