Kjøpe FII24N17AH1S med BYCHPS
Kjøp med garanti
FII24N17AH1S
- Delenummer:
- FII24N17AH1S
- Produsent:
- IXYS Corporation
- Beskrivelse:
- IGBT PHASE LEG HV ISOPLUS I4PAKS
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12646 Pieces
- Dataark:
- FII24N17AH1S.pdf
Introduksjon
BYCHIPS er strømprodusenten for FII24N17AH1S, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FII24N17AH1S via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 1700V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 6V @ 15V, 16A |
| Leverandør Enhetspakke: | ISOPLUS i4-PAC™ |
| Serie: | - |
| Strøm - Maks: | 140W |
| Pakke / tilfelle: | i4-Pac™-5 |
| Driftstemperatur: | - |
| NTC-termistor: | No |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 14 Weeks |
| Produsentens varenummer: | FII24N17AH1S |
| Input Kapasitans (Cies) @ Vce: | 2.4nF @ 25V |
| Input: | Standard |
| IGBT Type: | NPT |
| Utvidet beskrivelse: | IGBT Array NPT Half Bridge 1700V 18A 140W Through Hole ISOPLUS i4-PAC™ |
| Beskrivelse: | IGBT PHASE LEG HV ISOPLUS I4PAKS |
| Gjeldende - Samler Cutoff (Maks): | 100µA |
| Nåværende - Samler (Ic) (Maks): | 18A |
| konfigurasjon: | Half Bridge |
| Email: | [email protected] |
Beslektede deler til FII24N17AH1S
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
FII24N17AH1 | IXYS | IGBT PHASE LEG HV ISOPLUS I4PAK5 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers