Kjøpe FMM300-0055P med BYCHPS
Kjøp med garanti
FMM300-0055P
- Delenummer:
- FMM300-0055P
- Produsent:
- IXYS Corporation
- Beskrivelse:
- MOSFET 2N-CH 55V 300A I4-PAC-5
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14653 Pieces
- Dataark:
- FMM300-0055P.pdf
Introduksjon
BYCHIPS er strømprodusenten for FMM300-0055P, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FMM300-0055P via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | 4V @ 2mA |
|---|---|
| Leverandør Enhetspakke: | ISOPLUS i4-PAC™ |
| Serie: | - |
| Rds På (Maks) @ Id, Vgs: | 3.6 mOhm @ 150A, 10V |
| Strøm - Maks: | - |
| emballasje: | Tube |
| Pakke / tilfelle: | i4-Pac™-5 |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | FMM300-0055P |
| Inputkapasitans (Ciss) (Maks) @ Vds: | - |
| Gateavgift (Qg) (Maks) @ Vgs: | 172nC @ 10V |
| FET Type: | 2 N-Channel (Dual) |
| FET-funksjonen: | Standard |
| Utvidet beskrivelse: | Mosfet Array 2 N-Channel (Dual) 55V 300A Through Hole ISOPLUS i4-PAC™ |
| Drain til Source Voltage (VDSS): | 55V |
| Beskrivelse: | MOSFET 2N-CH 55V 300A I4-PAC-5 |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 300A |
| Email: | [email protected] |
Beslektede deler til FMM300-0055P
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers